常見的半導體材料有矽、鍺、砷化鎵等
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晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
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晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
Device yield or die yield is the number of working chips or dies on a wafer, given in percentage since the number of chips on a wafer (Die per wafer, DPW) can vary depending on the chips' size and the wafer's diameter. Yield degradation is a reduction in yield, which historically was mainly caused by dust particles, however since the 1990s, yield degradation is mainly caused by process variation, the process itself and by the tools used in chip manufacturing, although dust still remains a problem in many older fabs. Dust particles have an increasing effect on yield as feature sizes are shrunk with newer processes. Automation and the use of mini environments inside of production equipment, FOUPs and SMIFs have enabled a reduction in defects caused by dust particles. Device yield must be kept high to reduce the selling price of the working chips since working chips have to pay for those chips that failed, and to reduce the cost of wafer processing. Yield can also be affected by the design and operation of the fab.
Tight control over contaminants and the production process are necessary to increase yield. Contaminants may be chemical contaminants or be dust particles. "Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect. Electrostatic electricity can also affect yield adversely. Chemical contaminants or impurities include heavy metals such as Iron, Copper, Nickel, Zinc, Chromium, Gold, Mercury and Silver, alkali metals such as Sodium, Potassium and Lithium, and elements such as Aluminum, Magnesium, Calcium, Chlorine, Sulfur, Carbon, and Fluorine. It is important for those elements to not remain in contact with the silicon, as they could reduce yield. Chemical mixtures may be used to remove those elements from the silicon; different mixtures are effective against different elements.
Several models are used to estimate yield. Those are Murphy's model, Poisson's model, the binomial model, Moore's model and Seeds' model. There is no universal model; a model has to be chosen based on actual yield distribution (the location of defective chips) For example, Murphy's model assumes that yield loss occurs more at the edges of the wafer (non-working chips are concentrated on the edges of the wafer), Poisson's model assumes that defective dies are spread relatively evenly across the wafer, and Seeds's model assumes that defective dies are clustered together.[25]
Smaller dies cost less to produce (since more fit on a wafer, and wafers are processed and priced as a whole), and can help achieve higher yields since smaller dies have a lower chance of having a defect. However, smaller dies require smaller features to achieve the same functions of larger dies or surpass them, and smaller features require reduced process variation and increased purity (reduced contamination) to maintain high yields. Metrology tools are used to inspect the wafers during the production process and predict yield, so wafers predicted to have too many defects may be scrapped to save on processing costs.[26]
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我可以拜託你嗎?好不容易找到這張照˙是降子的..在這個月.對於我超重要的人生日.因為他很愛采潔.就上網找采潔的相關東西要送他.接著就看見了有位賣家在賣這張照片˙
因賣家說這是他在高雄dailo服飾買滿幾千才能得到.由於材質特殊不同於一般相當稀有..[真的有這回事嗎?] 賣家說她之前賣一張要價就要$5000
雖她這次開的價錢也只少了$500ˊˋ但因好臨時*怕趕不急˙便與她交易.事後朋友說一看就知是假的簽名海報
後來找了一張照片&你這張的簽名是相同的..重點是跟我買的那張截然不同~~我快昏了喇*簽名樣式不同也沒蝴蝶結..我能拜託你我好需要答案..我有她原始照˙不知你能不能幫幫我!!又或者你能告訴我得去哪求證簽名海報是真假..拜託~~~"
修正一下˙最上面我打沒好..她賣的正是這張照片中的大海報..不是照片..當然有著跟你們不同的簽名..還有就在昨日我還很客氣的跟賣家商量拜託退貨相關事宜..but她就簡短的說.錢已花掉沒法退 @@'
你買的商品照片給我看看~幫你確認看看唷!我是覺得有需要簽名可以找采潔本人簽就好!畢竟網路有很多仿冒的唷...
http://goods.ruten.com.tw/item/show?21005298755341 在這頁面˙最後是買下9樣$4500..我當時有用悄悄話問她來歷..就如同上所敘述>"< 再麻煩你了
是阿..本來就是要自己親自簽那種感覺最棒..但因為情急之下喪失理智了..我會僅記在心 **感謝你那摸快答覆
http://goods.ruten.com.tw/item/show?21008029091518 其實˙還買了這張m'car明信片..本來這2個買家想擇其一..因為就火燒眉頭了..2個都問.想說誰先回就買誰的..但2個就一起回 =.. = 呵[苦笑] 再拜託你看一下采潔有沒有簽過這種東西....知道的話再跟我說*乾恩
不知你有迷有無名?因我有..但我沒痞客邦
我能確定你那m'car明信片是假簽名~http://www.amberkuo.net/forum/viewthread.php?tid=7752&extra=page%3D1 這篇文章有說明~他是個惡劣不肖賣家 很多簽名都是仿冒的還仿的很差勁.....請節哀囉= = 另外你的dailo服飾海報~那張很稀有且材質真的很棒~不過簽名是我沒看過的款式~有可能是假的! 我跟過她很多dailo服飾活動看她在店家簽名跟幫歌迷簽名都沒有過她這種的~我相簿的郭采潔Amber相關珍藏^_^ 裡面有資料夾簽名~她都是簽那種的 ~所以應該也是彷的!想提高賣價吧...希望你能節哀囉~"~有試問我可以加我即時通:vcdlkkvcdlkk 無名我都沒再用關閉很久囉!!
非常的感激你..我也覺得那張大海報簽名非常假.又怪ˊˋ是否有管道能確認這簽名..因為雖知九成是假簽名˙但還是想知道..真的很謝謝你..幫我很多!!
我有去後援會˙試著加入..但還是進不去..所以沒看見討論他什摸..顯示 "對不起，您的 IP 地址不在被允許的範圍內，或您的賬號被禁用，無法訪問本論壇" 是說沒關西喇˙我知道確定是假的就好.3QU
管道就是問采潔迷們~大家都很熱心!要加入後援會要等待管理員審核通過方可登入!希望您之後不要在太衝動買到假貨了..^^"
嗯嗯..我知! 當然是因為太趕.親簽送人才有那份意義**總之非常非常的感謝U
不客氣啦!!^^
常見的半導體材料有矽、鍺、砷化鎵等
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
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步驟列表
晶片處理
濕洗
平版照相術
光刻Litho
離子移植IMP
蝕刻（干法蝕刻、濕法蝕刻、電漿蝕刻）
熱處理
快速熱退火Annel
熔爐退火
熱氧化
化學氣相沉積 (CVD)
物理氣相沉積 (PVD)
分子束磊晶 (MBE)
電化學沉積 (ECD)，見電鍍
化學機械平坦化 (CMP)
IC Assembly and Testing 封裝測試
Wafer Testing 晶片測試
Visual Inspection外觀檢測
Wafer Probing電性測試
FrontEnd 封裝前段
Wafer BackGrinding 晶背研磨
Wafer Mount晶圓附膜
Wafer Sawing晶圓切割
Die attachment上片覆晶
Wire bonding焊線
BackEnd 封裝後段
Molding模壓
Post Mold Cure後固化
De-Junk 去節
Plating 電鍍
Marking 列印
Trimform 成形
Lead Scan 檢腳
Final Test 終測
Electrical Test電性測試
Visual Inspection光學測試
Baking 烘烤
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有害材料標誌
許多有毒材料在製造過程中被使用。這些包括：
有毒元素摻雜物比如砷、硼、銻和磷
有毒化合物比如砷化三氫、磷化氫和矽烷
易反應液體、例如過氧化氫、發煙硝酸、硫酸以及氫氟酸
工人直接暴露在這些有毒物質下是致命的。通常IC製造業高度自動化能幫助降低暴露於這一類物品的風險。
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Device yield
Device yield or die yield is the number of working chips or dies on a wafer, given in percentage since the number of chips on a wafer (Die per wafer, DPW) can vary depending on the chips' size and the wafer's diameter. Yield degradation is a reduction in yield, which historically was mainly caused by dust particles, however since the 1990s, yield degradation is mainly caused by process variation, the process itself and by the tools used in chip manufacturing, although dust still remains a problem in many older fabs. Dust particles have an increasing effect on yield as feature sizes are shrunk with newer processes. Automation and the use of mini environments inside of production equipment, FOUPs and SMIFs have enabled a reduction in defects caused by dust particles. Device yield must be kept high to reduce the selling price of the working chips since working chips have to pay for those chips that failed, and to reduce the cost of wafer processing. Yield can also be affected by the design and operation of the fab.
Tight control over contaminants and the production process are necessary to increase yield. Contaminants may be chemical contaminants or be dust particles. "Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect. Electrostatic electricity can also affect yield adversely. Chemical contaminants or impurities include heavy metals such as Iron, Copper, Nickel, Zinc, Chromium, Gold, Mercury and Silver, alkali metals such as Sodium, Potassium and Lithium, and elements such as Aluminum, Magnesium, Calcium, Chlorine, Sulfur, Carbon, and Fluorine. It is important for those elements to not remain in contact with the silicon, as they could reduce yield. Chemical mixtures may be used to remove those elements from the silicon; different mixtures are effective against different elements.
Several models are used to estimate yield. Those are Murphy's model, Poisson's model, the binomial model, Moore's model and Seeds' model. There is no universal model; a model has to be chosen based on actual yield distribution (the location of defective chips) For example, Murphy's model assumes that yield loss occurs more at the edges of the wafer (non-working chips are concentrated on the edges of the wafer), Poisson's model assumes that defective dies are spread relatively evenly across the wafer, and Seeds's model assumes that defective dies are clustered together.[25]
Smaller dies cost less to produce (since more fit on a wafer, and wafers are processed and priced as a whole), and can help achieve higher yields since smaller dies have a lower chance of having a defect. However, smaller dies require smaller features to achieve the same functions of larger dies or surpass them, and smaller features require reduced process variation and increased purity (reduced contamination) to maintain high yields. Metrology tools are used to inspect the wafers during the production process and predict yield, so wafers predicted to have too many defects may be scrapped to save on processing costs.[26]